Wafer Probing
100% Electrical Probe Testing of up to 8" (200mm) wafers
Featuring:
■ Hot chuck capability to 125ºC
■ Parameter binning and electrical grading with datalog
■ Electronic map generation and/or inked wafer
■ Offline inking from most industry standard electronic map formats
■ Parameter matching for pairs and coupling
■ Flexible setup for both high and low volume.
Wafer Sawing
Precision dicing of wafers, ceramic substrates, glass and more
Featuring:
■ Repeatability accuracy: 0.001mm
■ Cutting range X-Y axis: >= 210 mm
■ Flexible setup & wide range of substrates and materials cut
■ Wider height profile than other conventional dicers
■ Absolute control of cutting water quality via DWR unit
■ Stay-Clean™ surfactant injection for particle free surface
Bare Die Pick & Placing
Automated picking of die sizes from 250µmx250µm (10x10 Mils) to 8.4mmx8.4mm (330x330 Mils)
Featuring:
■ 24-hour operation with high-speed throughput =>5K UPH
■ Integrated in-line inspection filtering out visual defects
■ Integrated in-line inspection filtering out ink dot rejects
■ Integrated electronic map picking from all industry recognized data formats
■ Integrated in-line rotational adjustment ensuring correct die orientation
■ Minimal contact made to the die top surface.
Automated picking of die sizes from 200µmx200µm (8x8 Mils) to 25mmx25mm (985x985 Mils)
Featuring:
■ Optional die inversion (die flipping) to prepare bumped bare die for automated assembly
■ Optional in-line backside visual inspection
■ Optional side collection for topside sensitive bare die
■ Integrated in-line inspection filtering out gross visual defects
■ Integrated in-line inspection filtering out ink dot rejects
■ Integrated electronic map picking from most industry recognized data formats.
Final QC / Visual Inspection
A combination of human and machine optical inspection applied to 100% of all outgoing bare die
Featuring:
■ Diode inspection to Mil-STD-750 Methods 2073, 2074
■ Transistor inspection to MIL-STD-750 Method 2072
■ IC inspection to MIL-STD-883 Method 2010 - Conditions A or B
■ Inspection to ESCC specifications
■ Inspection to Source Control Drawing (SCD)
■ Inspection to Customer Specification.