H Screening Flow
Sample distribution - Single diffusion, Multiple Wafers
Sample size - 20 PCS (5 destruct)
Pre-Sample Assembly
Die Visual Inspection - MIL-STD-750/TM2072, MIL-STD-750/TM2071, MIL-STD-883/TM2010B
Sample Assembly
Die Attach - MIL-STD-883/TM2010
Die Shear Test - MIL-STD-883/TM2019
Die Attach Inspection - MIL-STD-883/TM2011
Wire bond – Internal spec
Wire bond integrity - MIL-STD-883/TM2011
Pre-Cap inspection - MIL-STD-883/TM2010
Internal Die Visual - MIL-STD-883/TM2010B, MIL-STD-750/TM2072, MIL-STD-75/TM2073
Package seal - MIL-STD-883/TM1014
Seal Inspection - MIL-STD-883/TM2009
Sample coding – Internal spec
Sample Testing
Stability Bake - MIL-STD-883/TM1008
Interim Electrical Test @ 25°C - In accordance with device specification
Interim Electrical Test @ 125°C - In accordance with device specification
Interim Electrical Test @ -55°C - In accordance with device specification
120 hours burn-in @ 150°C - In accordance with device specification
Final Electrical Test @ 25°C - In accordance with device specification
Final Electrical Test @ 125°C - In accordance with device specification
Final Electrical Test @ -55°C - In accordance with device specification
Outgoing Die Release
From sample tested diffusion only
100% die visual inspection - MIL-STD-750/TM2072, MIL-STD-750/TM2071, MIL-STD-883/TM2010B