K Screening Flow
Sample distribution - Single diffusion, Single Wafer
Sample size - 20 PCS (5 destruct)
Pre-Sample Assembly
Die Visual Inspection - MIL-STD-750/TM2072, MIL-STD-750/TM2071, MIL-STD-883/TM2010B
SEM Inspection - Scanning Electron Microscopy – MIL-STD-883/TM2018
Sample Assembly
Die Attach - MIL-STD-883/TM2010
Die Shear Test - MIL-STD-883/TM2019
Die Attach Inspection - MIL-STD-883/TM2010
Wire bond – Internal spec
Wire bond integrity - MIL-STD-883/TM2011
Pre-Cap inspection - MIL-STD-883/TM2010
Internal Die Visual - MIL-STD-883/TM2010A, MIL-STD-750/TM2072, MIL-STD-75/TM2073
Package seal - MIL-STD-883/TM1014
Seal Inspection - MIL-STD-883/TM2009
Sample coding – Internal spec
Sample Testing
Stability Bake - MIL-STD-883/TM1008
Temperature Cycle - MIL-STD-883/TM1010
Centrifuge - MIL-STD-883/TM2001
Interim Electrical Test @ 25°C - In accordance with device specification
Interim Electrical Test @ 125°C - In accordance with device specification
Interim Electrical Test @ -55°C - In accordance with device specification
120 hours burn-in @ 150°C - In accordance with device specification
Post 120-hour Electrical Test @ 25°C - In accordance with device specification
Post 120-hour Electrical Test @ 125°C - In accordance with device specification
Post 120-hour Electrical Test @ -55°C - In accordance with device specification
Steady State Life Test @ 150°C – MIL-STD-883/TM1005
Life burn-in 240 hours - MIL-STD-883/TM1015
Final Electrical Test @ 25°C - In accordance with device specification
Final Electrical Test @ 125°C - In accordance with device specification
Final Electrical Test @ -55°C - In accordance with device specification
Outgoing Die Release
From sample tested wafer only
100% die visual inspection - MIL-STD-883/TM2010A, MIL-STD-750/TM2072, MIL-STD-75/TM2073